Micron Launch Works on $7 Billion Memory Chip Unit

The Nasdaq-listed Micron Technology Inc. on Wednesday launched works on a new $7 billion High-Bandwidth Memory (HBM) advanced packaging facility, the first of its kind, adjacent to the company’s current facilities in Singapore.

The ceremony was attended by Singapore’s Deputy Prime Minister, who is also Minister for Trade and Industry, Gan Kim Yong, Chairman of the Singapore Economic Development Board Png Cheong Boon, Executive Vice President of the Singapore Economic Development Board Pee Beng Kong, and JTC Corporation’s CEO Tan Boon Khai.

Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth. The launch of this facility will further strengthen Singapore’s local semiconductor ecosystem and innovation.

Micron’s President and CEO Sanjay Mehrohtra said that as AI adoption has been proliferating across industries, the demand for advanced memory and storage solutions will continue to increase robustly.

“With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead,” he added.

Micron’s HBM advanced packaging investment of $7 billion through the end of the decade and beyond will initially create around 1,400 jobs, with site expansion plans to reach an estimated 3,000 jobs in the future. These new roles will include functions such as packaging development, assembly and test operations.

Welcoming the significant investment by Micron Technology, Png Cheong Boon said that this reflected its confidence in Singapore’s competitiveness as a critical node in the global semiconductor supply chain.

First in Singapore

This is Singapore’s first high-bandwidth memory advanced packaging facility, allowing the city-status to contribute to global AI growth. It will also expand Singapore’s partnership with Micron and further strengthens the semiconductor ecosystem in Singapore, he said.

Micron’s future expansion plans in Singapore will also support long-term manufacturing requirements for NAND. Micron will maintain flexibility in managing the pace of capacity ramps in both the HBM and NAND facilities to align with market demand.  

Micron’s current facility in Singapore is the first front-end semiconductor fab in the world to be recognised as the Advanced Fourth Industrial Revolution Lighthouse and Sustainability Lighthouse by the World Economic Forum.

The new HBM advanced packaging facility will be built in alignment with Micron’s sustainability commitments and will feature technologies such as a greenhouse gas abatement, water recycling and waste circularity (reduce, reuse, recycle, recover).

The new building will be highly automated through AI-based intelligent solutions and designed to meet the Leadership in Energy and Environmental Design (LEED) certification requirements.